Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives
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United States of America Patent
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Apr 6, 1982
Grant Date -
N/A
app pub date -
Jul 8, 1980
filing date -
Jul 10, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.
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