Heat transfer structure for integrated circuit package
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United States of America Patent
Stats
-
Apr 6, 1982
Grant Date -
N/A
app pub date -
Feb 1, 1979
filing date -
Feb 1, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Heat is removed from a Large Scale Integrated Circuit semiconductor package via a thermal conductive path including a thermally conductive liquid. The integrated circuit chips are flip chip bonded to a substrate having a printed circuit and raised contact pads serving to interconnect contact areas on the chip. A metal, ceramic (or combination thereof) cover engages the perimeter of the substrate and encloses the chips (or chip). The thermal liquid is contained within the cavity define by the cover and substrate. The chips (or chip) and the flip chip connections are protected from contamination and the deleterious effects of the thermally conductive liquid by a parylene film enveloping same. Additionally, back side bonded (beam lead) integrated circuit chips will have an enhanced heat transfer path by incorporating liquid metal and a protective coating of parylene.
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