Integrated circuit carrier package test probe
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 20, 1982
Grant Date -
N/A
app pub date -
May 19, 1980
filing date -
May 19, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC carrier package test probe including a test probe head which is formed to penetrate into the IC chip cavity of the carrier package and which includes an elastic base having a thin layer of metal foil affixed to the outer face thereof, which foil is slited for greater elasticity and which is disposed to make simultaneous contact with each interior lead contact point within the cavity to permit rapid electrical testing of the continuity of the carrier package circuitry.
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