US Patent No: 4,343,662

Number of patents in Portfolio can not be more than 2000

Manufacturing semiconductor wafer devices by simultaneous slicing and etching

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Abstract

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A method of forming semiconductor devices incorporates etching during the slicing of a semiconductor ingot from which semiconductor wafers are formed. In addition, a partial slicing through the ingot yields partially cut wafers which are maintained integral beyond a diffusion step. Grinding is then employed to remove unwanted material, to shape, and to accomplish the separation of the wafers. A doped, silicon ingot is used with a solution of sodium hydroxide or potassium hydroxide as the etchant. With the ingot in the [111] type of crystal orientation, the etching proceeds readily adjacent to the slicing cuts to facilitate the slicing, and proceeds slowly elsewhere to minimize material wastage. As a result, the formation of extremely thin wafers with minimal cutting loss is possible.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ATLANTIC RICHFIELD COMPANYLOS ANGELES, CA992

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gay, Charles F Westlake Village, CA 10 426

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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (18)
6,250,192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1996
6,119,675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 19 1998
6,155,247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
6,006,739 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 33 1999
6,196,096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6,401,580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6,255,196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6,279,563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6,427,676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 14 2001
6,631,662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6,459,105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6,423,616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6,691,696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 5 2001
6,578,458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 10 2002
6,687,990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6,897,571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2002
6,932,077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7,387,119 Dicing saw with variable indexing capability 0 2005
 
Strasbaugh (2)
6,743,722 Method of spin etching wafers with an alkali solution 8 2002
7,160,808 Chuck for supporting wafers with a fluid 1 2004
 
AT&T Bell Laboratories (1)
5,123,996 Crystal growth method and apparatus 1 1991
 
AT&T IPM CORP. (1)
5,529,051 Method of preparing silicon wafers 7 1994
 
CAMBRIDGE ENERGY RESOURCES INC (1)
8,261,730 In-situ wafer processing system and method 0 2009
 
DELPHI TECHNOLOGIES, INC. (1)
5,461,008 Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers 34 1994
 
FLIPCHIP INTERNATIONAL (1)
5,632,667 No coat backside wafer grinding process 29 1995
 
HITACHI KOKI CO., LTD. (1)
5,558,571 Portable grinder 21 1994
 
KABUSHIKI KAISHA TOSHIBA (1)
5,185,295 Method for dicing semiconductor substrates using a laser scribing and dual etch process 34 1991
 
SAC CORP. (DE CORP.) (1)
4,465,550 Method and apparatus for slicing semiconductor ingots 4 1984
 
SHIN-ETSU HANDOTAI CO., LTD. (1)
5,494,862 Method of making semiconductor wafers 26 1994
 
Other [Check patent profile for assignment information] (1)
6,493,934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001

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