Importance

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Abstract

A carrier strip of polyimide resin sheet material carries on one face an etched pattern of metallization comprising temperature-independent resistors formed of an underlying metallization layer of tantalum base, temperature-dependent resistors in which the effect of the upper layer of metallization, of a nickel base, is predominant, and conductive paths provided by broader strips of the nickel base material. A cover layer of the same heat-resistant resin sheet material is sealed and bonded to the carrier strip wherever a metallization layer does not intervene, taking care to leave open certain contact areas for the attachment of connecting leads. A holder structure holds the strips at each end and provides clear space for attaching connecting leads as well. The holder structure is designed to allow the flow of medium to pass in good thermo contact with the portion of the device enclosing the resistance elements.

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First Claim