Packaging system for semiconductor burn-in
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United States of America Patent
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Sep 28, 1982
Grant Date -
N/A
app pub date -
Jul 7, 1980
filing date -
Jul 7, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates generally to burn-in apparatus and methods for stressing the physical and electrical limits of electronic components under controlled environmental and load conditions and more particularly to a system for temporarily packaging a plurality of semiconductors such that they can be connected to a common electrical input while under controlled environmental conditions including extremes of temperature. The invention has special utility in the handling of integrated circuit devices of the dual-in-line packaging type.
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