Method of plasma etching a substrate

United States of America Patent

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Nov 2, 1982
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N/A
app pub date
Nov 10, 1981
filing date
Nov 10, 1981

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Expired

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Abstract

A method of selectively removing a portion of a layer of material on a substrate by oxygen plasma etching utilizing a mask of a resist material comprising a poly(silane sulfone) copolymer.

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INTERSIL CORPORATION;RCA CORPORATION

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Inventor Name	Address	# of filed Patents	Total Citations
Kilichowski, Kurt B	Mercerville, NJ	6	67
Pampalone, Thomas R	Milltown, NJ	19	251

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Method of plasma etching a substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

06320016

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PATENT NO	4357369
SERIAL NO	06320016
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06320016

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