Importance

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Abstract

The present disclosure describes a probe assembly for use in the testing of integrated circuits. More specifically, the probe assembly finds particular application in high density printed circuit board configurations of flat pack integrated circuit (IC) packages. The invention is characterized by its ability to be readily positioned in either coordinate axis, so as to access all of the IC packages regardless of their mounting position. The probe itself is designed to separate and insulate the IC package leads from one another. Moreover, the point of electrical contact of the probe on the leads is predetermined and reproducible. Finally, the probe automatically locks on to the desired IC leads and exerts a force thereon which is independent of that applied by the operator. Electrical and mechanical damage which might otherwise result to the printed circuit board and the IC package is virtually eliminated by the probe assembly.

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First Claim