Adhesive composition
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United States of America Patent
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Feb 15, 1983
Grant Date -
N/A
app pub date -
May 12, 1981
filing date -
May 13, 1980
priority date (Note) -
Expired
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Abstract
A hot-melt adhesive composition comprising a polyamide and up to 10% by weight of the polyamide of an ethylene acrylic terpolymer and preferably also an acrylic rubber. The acrylic rubber is preferably a copolymer of ethyl acrylate, butyl acrylate, methoxy ethyl acrylate and ethoxy ethyl acrylate.
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