Semiconductor integrated circuit supporter having a heating element
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United States of America Patent
Stats
-
Feb 15, 1983
Grant Date -
N/A
app pub date -
Aug 22, 1980
filing date -
Aug 29, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor integrated circuit supporter on which a heating element is dielectrically provided, said supporter comprising a package, printed circuit board, mother board, etc. for supporting a semiconductor integrated circuit which includes devices such as transistors. The heating element provided on said semiconductor integrated circuit supporter is capable of heating the whole or a required part only thereof so that the semiconductor integrated circuit is preheated to a temperature required for its normal operation with precision and stability thereby improving the accuracy and reliability of various devices of which a semiconductor integrated circuit is composed as well as the control by said devices.
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