Method of fabricating complex micro-circuit boards and substrates
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United States of America Patent
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Feb 22, 1983
Grant Date -
N/A
app pub date -
Aug 4, 1980
filing date -
Aug 4, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate and method of manufacture wherein a substrate is molded from particulate material wherein grooves on and through the body are formed during substrate molding and prior to sintering. The substrate includes all buss structure molded therein. Cooling of chips is provided by providing a heat sink in an aperture formed within a substrate and beneath the chips.
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