Method of positioning disk-shaped workpieces, preferably semiconductor wafers
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United States of America Patent
Stats
-
Mar 15, 1983
Issued Date -
N/A
app pub date -
Dec 29, 1980
filing date -
Dec 20, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the photoexposure of semiconductor wafers for the production of circuit elements, the wafers are placed in a prealignment position before being transferred to the exposure stage. A chuck acting as a prepositioning stage is rotatable by one servomotor to set the wafer in its appropriate angular position (.phi. adjustment) and is shiftable by respective servomotors in the X and Y directions. Servomotor control is effected by optical means detecting a noncircular edge portion of the wafer as well as alignment marks on the wafer inwardly of the edge thereof.
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