Process for transferring a pattern onto a semiconductor disk
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United States of America Patent
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Apr 12, 1983
Issued Date -
N/A
app pub date -
May 21, 1981
filing date -
Sep 21, 1979
priority date (Note) -
Expired
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Abstract
A planar, solid, light-transmitting coating (7) is applied directly to a photoresist layer (6) before the exposure of the latter in the production of integrated circuits by photolithography. Any dust particles will thus be held separated from the photoresist layer (6) by a distance at which they are less effective optically. The probability of the occurrence of standing waves is reduced by increasing the total thickness of the combined layer (6+7) covering the semiconductor (5) proper.
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