Sublimation patterning process
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United States of America Patent
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Jun 14, 1983
Grant Date -
N/A
app pub date -
Sep 22, 1980
filing date -
Sep 22, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for patterning layers of material on a substrate without photoresist by using a selective sublimation process. Differences in thermal conductivity of materials underneath a layer of material to be patterned cause patterning by sublimation over areas of low thermal conductivity, initiated by a pulsed or swept radiated energy source.
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