Vertical integrated circuit package integration
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United States of America Patent
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-
Aug 9, 1983
Grant Date -
N/A
app pub date -
Sep 11, 1980
filing date -
Sep 11, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A compact assembly of similar type integrated circuit packages having a functionally similar terminal lead in non-corresponding lead positions. Two interconnection packages, of a type similar to the integrated circuit packages, are nested between the integrated circuit packages to re-route an electrical path from a terminal lead location on one integrated circuit package to a functionally similar but differently located lead position on the other integrated circuit package.
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