Adapting contacts for connection thereto
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United States of America Patent
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-
Sep 6, 1983
Grant Date -
N/A
app pub date -
Aug 21, 1981
filing date -
Aug 21, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Contact pads (18) of a device (12) are adapted for bonding components such as contacts of a circuit assembly thereto. At least two of the pads (18) are interconnected with a member (34) containing bonding material. Portions of the member (34) lying adjacent the pads (18) are then removed to form isolated bodies (42) containing bonding material on the pads (18). The member (37) may be of a composite structure containing bonding material associated with a hard element (61). The bodies (42) formed therefrom contain a hard element portion (62) having dimensions which remain substantially unchanged to define a desired minimum distance between respective pads (18) and contacts when they are bonded together.
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