Manufacture of printed circuit boards
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United States of America Patent
Stats
-
Sep 13, 1983
Grant Date -
N/A
app pub date -
Jan 14, 1981
filing date -
Jan 23, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for the manufacture of a printed circuit board is disclosed in which, during the process, conductive tracks 6 are tested for defects 8 relating to their conductivity and any detected defect 8 is repaired by securing a conductive bridge-piece 9 across the defect 8 by a reflow soldering operation. The repair is encapsulated with a protective layer 16 and the manufacturing process, which includes the further application of heat to the circuit board, is continued.
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Family
International Classification(s)
- Non-US Classification not provided for expired patents
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided for expired patents
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