Dual-in-line package assembly
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United States of America Patent
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-
Sep 27, 1983
Grant Date -
N/A
app pub date -
Jul 2, 1981
filing date -
Jul 2, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A dual-in-line package assembly for interconnection with a printed circuit board includes a base having a plurality of free-standing contacts and a DIP carrier having channels extending therethrough for jointly receiving DIP lead and base contacts and for biasing resililent portions of the base contacts upon the DIP leads interiorly of the carrier. The channels of carriers stacked in the assembly have common base contacts passing therethrough in registry with a lead of each stacked package.
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