Ceramic chip carrier with lead frame having removable rim
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United States of America Patent
Stats
-
Oct 4, 1983
Grant Date -
N/A
app pub date -
Mar 27, 1981
filing date -
Mar 27, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without altering the relative positions of the tip portions. The rim is thus raised above the center region of the substrate and does not bond to the substrate and is thus readily removed after bonding the lead frame to the substrate.
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Cited Art Landscape
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