US Patent No: 4,408,255

Number of patents in Portfolio can not be more than 2000

Absorptive electromagnetic shielding for high speed computer applications

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Importance

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Abstract

An electromagnetic shield comprising two portions in which the first portion consists of a magnetically permeable mat with a conductive sheet bonded to one side and an insulating sheet bonded to the opposite side. In a typical application, this first portion is positioned with the insulating sheet making contact to the underside of a printed circuit board. The second portion consists of a magnetically permeable mat with a conductive sheet bonded to each side. The mat is porous and one of the conductive sheets contains a plurality of openings to permit cooling air which is forced through the pores of the mat to pass through these openings. The conductive sheet containing the plurality of openings is positioned adjacent the components on the upper side of a printed circuit board to provide cooling as well as closely positioned shielding.

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First Claim

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Patent Owner(s)

  • Assignment data not available. Check USPTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adkins, Harold 56 Camille La., East Patchogue, NY 11772 1 42

Cited Art

Patent Info (Count) # Cites Year
 
GOTTLIEB COMMERCIAL COMPANY A/S (1)
4,287,243 Mat for multispectral camouflage of objects and permanent constructions 28 1979

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MINNESOTA MINING AND MANUFACTURING COMPANY (6)
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5,085,931 Microwave absorber employing acicular magnetic metallic filaments 20 1990
5,238,975 Microwave radiation absorbing adhesive 15 1992
5,631,807 Electronic circuit structure with aperture suspended component 29 1995
5,689,600 Electronic circuit structure 11 1996
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
5,428,506 Circuit board EMI suppressor including a lossy dielectric layer 27 1992
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MEMTEC AMERICA CORPORATION (2)
5,525,423 Method of making multiple diameter metallic tow material 12 1994
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SAMSUNG ELECTRONICS CO., LTD. (2)
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5,675,299 Bidirectional non-solid impedance controlled reference plane requiring no conductor to grid alignment 21 1996
 
SUN MICROSYSTEMS, INC. (2)
5,992,168 Circuit board having an integral sorber 7 1999
7,003,979 Method and apparatus for making a sorber 0 2000
 
AT&T BELL LABORATORIES (1)
5,121,290 Circuit pack cooling using perforations 18 1990
 
ENTERASYS NETWORKS, INC. (1)
5,535,099 Enclosure for electronic modules 8 1994
 
FUJITSU LIMITED (1)
5,206,986 Method of producing an electronic circuit package 32 1992
 
FUSION UV SYSTEMS, INC. (1)
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4,939,024 Radiowave absorbing body of the high electrical power-resistant type 1 1989
 
HONEYWELL BULL INC. (1)
5,075,867 Method for limiting spurious resonant cavity effects in electronic equipment 0 1988
 
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO., LTD. (1)
7,607,790 Backlighting apparatus and manufacturing process 2 2006
 
HOUSTON INDUSTRIES INCORPORATED (1)
5,546,809 Vibration monitor mounting block 7 1996
 
HOWELL INSTRUMENTS, INC. (1)
4,884,171 Electromagnetic interference shielding device for a portable aircraft engine tester 9 1988
 
KITAGAWA INDUSTRIES CO., LTD. (1)
5,097,885 Aperture cover for blocking electromagnetic radiation 14 1991
 
LAIRD TECHNOLOGIES, INC. (1)
7,135,643 EMI shield including a lossy medium 24 2002
 
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OSAKA PREFECTURAL GOVERNMENT (1)
4,828,931 Superconductor for magnetic field shielding 15 1988
 
PARLEX USA INC. (1)
5,334,800 Flexible shielded circuit board 35 1993
 
RENESAS ELECTRONICS CORPORATION (1)
5,358,032 LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted 30 1993
 
ROCHESTER INSTITUTE OF TECHNOLOGY (1)
6,574,103 Enclosure with RF isolation for circuit packs 2 2002
 
SAINT-GOBAIN ISOVER (1)
6,512,173 Insulation plates with protection against electromagnetic fields 4 2000
 
SONY ELECTRONICS INC. (1)
6,252,159 EMI/RFI and vibration resistant electronics enclosure 5 1999
 
TERADATA US, INC. (1)
5,473,508 Focused CPU air cooling system including high efficiency heat exchanger 31 1994
 
THE BOEING COMPANY (1)
4,997,993 Method and apparatus for sealing movable panel and maintaining low signature integrity 3 1990
 
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (1)
H000526 Non-metallic chassis structure with electromagnetic field attenuating capability 3 1987
 
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5,374,779 Electro-magnetic wave shielding structure 7 1993
 
UNISYS CORPORATION (1)
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UTSTARCOM, INC. (1)
6,185,109 Electronic chassis apparatus and method 7 1999
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
H526 Non-metallic chassis structure with electromagnetic field attenuating capability 16 1987