Method for the evaluation of solderability
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 11, 1983
Grant Date -
N/A
app pub date -
Dec 4, 1981
filing date -
Dec 4, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test procedure is disclosed for evaluating the solderability properties of molten solder. In the method of this invention, a testpiece is provided which has a transparent support with a film of metal such as copper deposited on one surface of the transparent support. The surface having the metal film is immersed in the molten solder and the time required for alloying to occur and be observed through the transparent support is measured to determine rate of alloying and, thereby, the solderability properties of the molten solder under evaluation.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully