Wafer-handling tool
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United States of America Patent
Stats
-
Oct 18, 1983
Grant Date -
N/A
app pub date -
Mar 11, 1982
filing date -
Mar 11, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A special tool designed for picking up and holding circular silicon wafers, the tool incorporating a spring-biased plunger. As the plunger is withdrawn by the spring, a grooved tip at the end of the extended plunger engages one edge of the wafer, driving the opposite edge of the wafer into an arcuate groove on an opposing surface of the body of the tool.
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