Cast solder leads for leadless semiconductor circuits
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United States of America Patent
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-
Nov 1, 1983
Grant Date -
N/A
app pub date -
Mar 15, 1982
filing date -
Mar 15, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The attachment of leadless chip carriers to printed wiring boards by means of soldering techniques must provide for a spacing between the chip carrier and the board. Such spacing is required for cleaning the area under the chip carrier, protecting the underlying circuitry, and accounting for stresses which may develop due to thermal mismatch between the chip carrier and the board, and to board flexure. Herein disclosed is a lead (15) for semiconductor chip carriers comprising an elongated body of high melting point electrically conductive material, e.g., solder material. Also disclosed is a method for casting such a solder lead, and a method for attaching a plurality of cast solder leads (38) to a leadless chip carrier (20).
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