Sputtering apparatus
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United States of America Patent
Stats
-
Nov 1, 1983
Grant Date -
N/A
app pub date -
Dec 21, 1981
filing date -
Dec 27, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputtering apparatus includes a target and a substrate holder respectively supported in a lower portion and an upper portion of a vacuum chamber, a gas jet opening located near the upper surface of the target, and gas withdrawal conduits located near the substrate holder, so that by supplying a gas to the vacuum chamber through the gas jet opening, the gas pressure in the chamber gradually decreases from the region near the target to the region near the substrate holder.
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