Method for mounting a semiconductor device in a housing
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United States of America Patent
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-
Nov 29, 1983
Grant Date -
N/A
app pub date -
Dec 22, 1980
filing date -
Jan 17, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method and apparatus for mounting a semiconductor device in a housing, which includes first providing a metallization on a part of the surface of the semiconductor body of the semiconductor device to be connected to the housing, subsequently permanently connecting the semiconductor body to a part of the housing being in the form of a substrate with an organic adhesive to which metal particles have been added, and connecting electrodes of the semiconductor device to terminals disposed in the housing.
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