High melting point process for Au:Sn:80:20 brazing alloy for chip carriers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 6, 1983
Grant Date -
N/A
app pub date -
Dec 31, 1980
filing date -
Dec 31, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Brazing of elements to electronic chip carrying substrates requires brazing materials strong at high temperatures used to remove and replace chips. Flanges and pins are brazed with Au:Sn brazing alloys modified during brazing by addition of Group IB metal to the brazing material to promote formation of the higher melting point .beta. phase of the alloy and a Group VIII metal to draw Sn out of the melt by gettering, also to promote formation of the .beta. phase of the alloy and to thicken the braze material. An Au preform is plated with Ni and juxtaposed with surfaces to be brazed and the brazing materials to add Ni and Au to the melt almost simultaneously.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully