Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
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United States of America Patent
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Dec 13, 1983
Grant Date -
N/A
app pub date -
Oct 26, 1981
filing date -
Oct 26, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Technique for terminating signal leads on a substrate for a semiconductor chip to discrete resistors to eliminate impedance discontinuities involves a substrate having signal leads connected to resistive material which is in turn connected to a ground bus. Laser trimming equipment is used to selectively disconnect signal leads from the resistor zone, or to create separate resistor paths for each signal lead to bus, while trimming the resistor to the required transmission line terminating value. The signal leads are connected to the semiconductor chip by elevated leads which pass over the resistive material and the ground bus.
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