Wafering system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 20, 1983
Grant Date -
N/A
app pub date -
Nov 10, 1981
filing date -
Nov 10, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture in the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slide for moving the head back and forth and a carriage for vertically moving the head up and down. A motor is used to actuate the carriage while air cylinders are used to actuate the slide and pivot arm assembly.
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