Method of making constant bonding wire tail lengths
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 27, 1983
Grant Date -
N/A
app pub date -
Jan 12, 1981
filing date -
Jan 12, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a high speed automatic fine wire bonding machine of the type adapted to produce a wire interconnection between two bonding points on a semiconductor device there is provided a method of making consistent, exact predetermined lengths of wire under the working face of a bonding tool after a second bond is finished and in preparation for making the next first bond of a wire interconnection.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully