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Abstract

Thin film multilayer technology is used to build microminiature electromechanical switches having low resistance metal-to-metal contacts and distinct on-off characteristics. The switches, which are electrothermally actuated, are fabricated on conventional hybrid circuit substrates using processes compatible with those employed to produce thin-film electrical circuits. In a preferred form, such a switch includes a cantilever actuating member comprising a resiliently bendable strip of a hard insulating material (e.g., silicon nitride) to which a metal (e.g., nickel) heating element is bonded. The free end of the cantilever member carries a metal contact, which is moved into (or out of) engagement with an underlying fixed contact by controlled bending of the member via electrical current applied to the heating element.

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First Claim