Wafer aligners
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United States of America Patent
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-
Jan 10, 1984
Grant Date -
N/A
app pub date -
Apr 20, 1981
filing date -
Apr 20, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for prealigning a silicon wafer prior to transfer to a work station. The wafer is spun on an aligning platform by means of air jets emanating from holes disposed in the surface of the platform while simultaneously being stopped by means of a vacuum source communicating with the surface of the platform. Sensor means detect when the wafer is centered within a first predetermined tolerance to turn off the air jets and vacuum to stop the wafer. Control means responsive to the sensor means then center the wafer to within a second predetermined tolerance. The wafer is then transported to the work station for processing.
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