US Patent No: 4,428,523

Number of patents in Portfolio can not be more than 2000

Metallic solder composite bonding

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Abstract

A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
UNITED TECHNOLOGIES CORPORATIONHARTFORD, CT5458

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bacon, James F Manchester, CT 5 36
Snitzer, Elias Piscataway, NJ 40 1617

Cited Art

Patent Info (Count) # Cites Year
 
UNITED TECHNOLOGIES CORPORATION (2)
4,263,367 Discontinuous graphite fiber reinforced glass composites 31 1979
4,265,968 High strength, high thermally conductive articles 24 1980

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AEROSPATIALE SOCIETE NATIONALE INDUSTRIELLE (2)
4,607,780 Method of temporary solder assembling of releasable plates for mechanical release device 2 1984
4,740,099 Assembly obtained from method of temporary solder assembling of releasable plates for mechanical release device 8 1986
 
The United States of America as represented by the Secretary of the Air Force (2)
4,649,085 Cryogenic glass-to-metal seal 52 1984
4,726,507 Cryogenic glass-to-metal seal 7 1986
 
COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION (1)
5,102,029 Microwave integrated circuit package to eliminate alumina substrate cracking and method 5 1990
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,180,097 Method of mounting an electronic part onto a printed circuit board 9 1990
 
SCHWARZKOPF TECHNOLOGIES CORPORATION, A CORP. OF MD (1)
5,580,670 Heavily thermally stressable component 2 1995
 
TEXTRON IPMP L.P. (1)
5,043,032 Method for detecting protective layer on composite materials 4 1989
 
UNITED TECHNOLOGIES CORPORATION (1)
5,122,226 Method of making hybrid composite structures of fiber reinforced glass and resin matrices 5 1987