
US Patent No: 4,428,523
Number of patents in Portfolio can not be more than 2000
Metallic solder composite bonding
Stats
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Jan 31, 1984
Issued date -
Jan 11, 1982
filing date -
06/338,823
serial no -
Expired
status
Importance
Abstract
A method of bonding a plurality of thermally stable high strength graphite fiber reinforced glass matrix composite pieces is described. The process comprises applying to the surfaces to be bonded at least one layer of a metal which is highly adherent to the composite and the solder and is oxidatively stable. A tie layer may be used between the composite bond surface and the metal layer to better bond the metal layer to the composite. Following application of the metal layer, the composite pieces are stacked with the metal layers facing each other and a solder layer in between. The temperature of the assembly is raised to melt the solder and form the bond. The melting temperature of the solder and the metal layers are chosen so as to be higher than the use temperature of the bonded composite. A bonded composite article thus formed is also described.
First Claim
Related Publications
International Classification(s)
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,263,367 Discontinuous graphite fiber reinforced glass composites | 31 | 1979 | |
| 4,265,968 High strength, high thermally conductive articles | 24 | 1980 | |