Method of mounting a semiconductor element for analyzing failures thereon
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United States of America Patent
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-
Feb 14, 1984
Grant Date -
N/A
app pub date -
Aug 21, 1980
filing date -
Aug 28, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip having its main face coated with an electrically insulating film is encapsulated in a plastic, electrically conducting member disposed on a metallic plate so that the surface of the insulating member is exposed and parallel to the metallic plate. The surface of the insulating film is observed by an optical microscope through a nematic liquid crystal film and a glass slide with a transparent, electrically conducting coating successively disposed on the chip with a DC voltage applied between the conducting coating and the metallic plate.
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