Temperature-controlled support for semiconductor wafer
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United States of America Patent
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-
Feb 21, 1984
Issued Date -
N/A
app pub date -
Mar 31, 1982
filing date -
Dec 20, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A support for a semiconductor wafer about to be subjected to exposure through a photomask, e.g. a rotatable chuck, comprises a stage to which the wafer is temporarily adhered by suction and whose temperature is controlled by an array of Peltier elements responsive to a thermoelectric sensor disposed close to the wafer-carrying stage surface. The Peltier elements are horizontally arrayed in a rectangular block inserted between the stage and an underlying base of the support, the block being cemented into a metal frame which has only limited contact with the stage and the base to minimize heat conduction therebetween. The base has channels for the circulation of a temperature-modifying fluid such as water.
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