Apparatus for heat treating semiconductor wafers
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United States of America Patent
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Mar 13, 1984
Grant Date -
N/A
app pub date -
May 3, 1982
filing date -
May 3, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In the heat treating apparatus disclosed herein, a semiconductor wafer, held in a vacuum chuck, is traversed under an infrared source in which radiant energy from a linear, high intensity lamp is focused by an elongate elliptical reflector to generate a linear target zone through which the surface of the wafer is effectively scanned by the relative motion.
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