Method and apparatus for bonding metal wire to a base metal substrate
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United States of America Patent
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-
Mar 20, 1984
Grant Date -
N/A
app pub date -
Jul 9, 1980
filing date -
Jul 9, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process and apparatus for bonding lead wires to a metal substrate. A lead wire is positioned on the substrate and a spot of metal is deposited over a portion of the lead wire and metal substrate to firmly bond the wire to the substrate.
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