Importance

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Abstract

A method and apparatus for automatically extracting a series of integrated circuit packages from their sockets without bending the leads thereof. A plurality of extraction fingers are caused to be moved between a socket mounting an integrated circuit package and the package to an extent to permit the package to be extracted from its socket in a direction substantially perpendicular to the plane of the socket. The extracted packages are controlled after their release to cause them to travel through a checking station to determine the condition of their leads. The integrated circuit packages that have not been damaged will continue to travel down an incline and be accumulated. The damaged integrated circuit package will be held at the checking station and then ejected automatically from the apparatus during the operation of an extraction cycle.

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First Claim