Resoldering tool for ceramic substrate hybrid electronic circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 10, 1984
Grant Date -
N/A
app pub date -
Jun 4, 1982
filing date -
Jun 4, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reworking tool for ceramic substrate hybrid circuits has a metal base for sitting on a heated surface, a support member support above the base and a pillar of heat conductive material attached to the base and extending up through an aperture in the support member. The top surfaces of pillar and support member are in a common plane. By this means a 'hot spot' is produced at the top of the pillar and a hybrid circuit positioned on the support member can be so positioned that a particular component position is resting on the top of the pillar. Solder at this component position will melt and a component can be removed, or a component added or a component removed and another placed in position. Lateral sliding of the hybrid circuit laterally on the support member enables the solder to solidify.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully