Soft solder material for use in the formation of a solder bath
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United States of America Patent
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Apr 10, 1984
Issued Date -
N/A
app pub date -
Jul 8, 1983
filing date -
Mar 17, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Solder baths for use in the electronics industry are formed by converting into a molten condition a soft solder material in the form of an extruded bar of soft solder alloy having one or more cores composed of (I) esters of polyhydric alcohols of molecular weight of at least 300, (II) ester derivatives of rosin or modified rosin, (III) hydrocarbon resins, and/or (IV) polymeric waxes, so that the resulting solder bath is provided with a layer of anti-oxidant material derived from the cores which assists in preventing formation of oxide impurity on the surface of the molten solder bath and which may also act as a solder flux, thereby obviating the conventional necessity of applying a separate antioxidant material to the surface of the bath and of using a separate solder flux.
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