Method of providing raised electrical contacts on electronic microcircuits
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United States of America Patent
Stats
-
Apr 17, 1984
Grant Date -
N/A
app pub date -
Mar 1, 1982
filing date -
Mar 20, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion.
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