Heat-moldable laminate and process for molding said laminated structures
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United States of America Patent
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-
Apr 17, 1984
Issued Date -
N/A
app pub date -
Aug 30, 1982
filing date -
Jan 26, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat-moldable laminate comprising at least one thermoplastic resin layer, at least one fiber reinforced cured thermosetting resin layer, and at least one slippage layer interposed therebetween and bonding the resin layers, said slippage layer comprising a thermoplastic resin and said slippage layer being capable of being molten at lower temperatures than the moldable temperature of the thermoplastic resin layer, and a process for molding the heat-moldable laminate to produce a molded article having excellent strength and rigidity is disclosed.
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