Automatic liquid dispensing apparatus for spinning surface of uniform thickness
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United States of America Patent
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May 29, 1984
Grant Date -
N/A
app pub date -
Oct 29, 1982
filing date -
Oct 29, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An automatic fluid dispensing apparatus for coating to a substantially uniform thickness a rotating surface, such as the surface of a semiconductor wafer, with a viscous liquid, such as a slurry of passivating glass. The wafer rotation rate is related to the radial movement of a dispensing arm to maintain a constant tangential velocity of the wafer at the radial location of the dispensing arm while a bead of the slurry is dispensed at a constant rate proportional to the tangential velocity to provide a spiral beaded coating of constant volume per square. By allowing the bead to heal during or following the dispense cycle, the viscous liquid spreads to a uniform thickness.
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