Assembly of an externally ventilated semiconductor arrangement
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United States of America Patent
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-
Jul 10, 1984
Grant Date -
N/A
app pub date -
Nov 4, 1981
filing date -
Nov 5, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor circuit arrangement including at least one semiconductor unit provided with a base plate and semiconductor element electrically insulated against the base plate, current conductors connected to the semiconductor unit and a cooling member supporting the semiconductor unit. The arrangement includes a cooling air channel which is divided into a first zone enclosing the cooling member and a second zone enclosing the semiconductor unit and the current conductors connected thereto. A fan is connected for circulating air in the cooling channel. A baffle plate is disposed in the second zone at a distance from the cooling member and is provided with openings for passage of the current conductors. A circuit board for supporting additional circuit elements is disposed to delimit one dimension of the second zone.
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