Coated substrate, preparation thereof, and use thereof
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United States of America Patent
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Jul 17, 1984
Grant Date -
N/A
app pub date -
Nov 24, 1981
filing date -
Nov 24, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductive substrate wherein the major surfaces thereof are embossed and wherein coated on at least one of the major surfaces is a sintered porous metal powder coating, and preparation of the substrate. The substrate is especially suitable as an electrode in an electrolytic cell when the substrate includes an electrochemically active material within the pores of the sintered porous metal powder coating.
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