Method of and apparatus for the positioning of disk-shaped workpieces, particularly semiconductor wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 24, 1984
Issued Date -
N/A
app pub date -
Sep 28, 1982
filing date -
Dec 20, 1979
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the photoexposure of semiconductor wafers for the production of circuit elements, the wafers are placed in a prealignment position before being transferred to the exposure stage. A chuck acting as a prepositioning stage is rotatable by one servomotor to set the wafer in its appropriate angular position (.phi. adjustment) and is shiftable by respective servomotors in the X and Y directions. Servomotor control is effected by optical means detecting a noncircular edge portion of the wafer as well as alignment marks on the wafer inwardly of the edge thereof.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully