Cryopump or heat pump circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 24, 1984
Grant Date -
N/A
app pub date -
Sep 13, 1982
filing date -
Oct 1, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a cryopump or heat pump circuit having in series a compressor, a condenser, an expansion valve and an evaporator. The expansion valve is controlled as normally by a sensor which is responsive to the superheating of refrigerant at the outlet of the evaporator. In order to assure sufficient dryness of the evaporator output to make the expansion valve operative, the sensor is connected to a heat source which generates a sufficient amount of heat so that the sensor assumes a temperature corresponding to the set superheating.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully