Bondable polyamide
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United States of America Patent
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-
Jul 24, 1984
Issued Date -
N/A
app pub date -
Dec 5, 1983
filing date -
Oct 14, 1981
priority date (Note) -
Expired
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Abstract
Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.
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