Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate
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United States of America Patent
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-
Jul 31, 1984
Grant Date -
N/A
app pub date -
Dec 23, 1982
filing date -
Dec 29, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it is held in position because of the adhesive capacity of the flux; heating in a furnace containing a nitrogen atmosphere and having a peak temperature of 350.degree. C. to cause a solder reflow; and allowing to cool to enable the solder to set and to provide a permanent electrical and mechanical bond between the head of the pins and the eyelets. This method is suitable for use in manufacturing electronic modules employed in computers.
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