Device for the simultaneous mounting of components on a carrier
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United States of America Patent
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-
Aug 14, 1984
Issued Date -
N/A
app pub date -
May 17, 1983
filing date -
Jan 21, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electronic components are mounted on a substrate from thin-walled magazines which are arranged in a configuration corresponding to a desired implantation of the components. Stacks of components are pushed upwards in the magazines by a pulse of compressed gas in order to press the components against the substrate which has been arranged over the magazines with conductor tracks facing downwards. Local application of an adhesive solder paste to the substrate causes the component on the top of each stack to adhere to and be lifted simultaneously with the substrate.
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Cited Art Landscape
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