Importance

Loading Importance Indicators...

Abstract

A method and apparatus for slicing solid materials, such as silicon, germanium, glass, ceramics, gallium arsenide, etc. by reactive chemicals which are carried to the workpiece by a travelling flexible member such as a wire or cable. More particularly, the invention relates to a method and apparatus for slicing ingots of the above-mentioned substances into wafers for use in the fabrication of integrated circuit, solar cells and the like. The reactive chemical preferably is a molten salt which reacts with the semiconductive material, and the flexible member is preferably electrically conductive and heated by passing a current through such member to ensure that the salt is reactive only at the location of contact of such flexible member with the ingot being sliced.

Loading the Abstract Image...

First Claim